Reliable solder connections are critical to PCB manufacturing and component assembly. As components age, and as a result of storage conditions, oxide layers can grow in thickness on the surface plating. Another common problem that can occur over time involves the migration of intermetallic compounds (IMCs).
Both of these naturally occurring conditions can lead to degraded performance of solder connections in both surface mount and through hole applications.
To verify the quality of solder connections, North Shore Components offers comprehensive in house solderability testing utilizing the Menisco ST 78 wettability tester, which is compliant with all major international standards and specifications for wetting balance testing, including:
- ANSI/J-STD 002
- ANSI/J-STD 003
- MIL STD 0883D
- IEC 68-2-69
The Menisco ST 78 is equipped with a sample preheat process, 2kg solder pot with variable temperature control up to 500°C (+-2°C), wetting balance sensor, windows-based driver and controller, adjustable timer (5 to 120 sec), two dip and look options:1 to 30 sec – step 1 sec); and adjustable immersion speed of 2mm/sec and from ¼” to 2” step ¼”. Overall immersion specifications include depth ranging from 0.1 to 10mm by step of 0.1mm and variable speed from1 to 50 mm/sec (step 1mm/sec). Withdrawal speed of the Menisco ST 78 is also variable from 1 to 50 mm/sec (step 1/mm/sec).
The Menisco ST 78 provides comprehensive test data reports related to:
- Component solderability
- Flux efficiency
- Quality of solder joints
For more information on North Shore Component’s in house solderability testing capabilities, contact us today.
