North Shore Components offers in house baking and dry packing services in compliance with OEM specifications and IPC/JEDEC-J-STD-033B.
To protect moisture/reflow sensitive chips, components and surface mount devices (SMD), North Shore Components utilizes a two-step process that combines oven drying and vacuum sealing in moisture-resistant packaging, which typically provides moisture resistant shelf life for a minimum of one year.
Components are baked to OEM moisture level specifications using an industrial convection oven to ensure uniform temperatures across all tray layers as well as precise thermal set point control throughout all heating and cooling phases. A computer interface allows for custom baking “profiles” along with data collection and reporting when required.
After baking, all trays are immediately triple strapped and room air is purged prior to vacuum sealing in high quality “heavy wall” ESD bags that contain humidity indicator cards and moisture absorbing desiccant packs. Customer-supplied labeling can also be applied upon request.
For more information on in house oven baking and dry packing services, contact us today.
